Through Silicon Vias Materials, Models, Design, and Performance 1st Edition
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Through Silicon Vias Materials, Models, Design, and Performance 1st Edition

SKU: 9781315351797

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Additional information

Full Title

Through Silicon Vias Materials, Models, Design, and Performance 1st Edition
Author(s)

Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam
Edition

1st Edition
ISBN

9781315351797, 9780367574543, 9781315368825, 9781498745543, 9781498745529, 9781498745536, 9781315332758
Publisher

CRC Press
Format

PDF and EPUB

Description

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.